Design and Computer Simulation of Path Planning System for Bamboo Clearing Machine

WANG Hui, CUI Sheng-le, YANG Chun-mei

Packaging Engineering ›› 2022 ›› Issue (3) : 217-227.

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PDF(13979 KB)
Packaging Engineering ›› 2022 ›› Issue (3) : 217-227. DOI: 10.19554/j.cnki.1001-3563.2022.03.027

Design and Computer Simulation of Path Planning System for Bamboo Clearing Machine

  • WANG Hui, CUI Sheng-le, YANG Chun-mei
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Abstract

The work aims to design an intelligent path planning system for young and middle-aged bamboo clearing machines, achieve the cutting path planning of bamboo clearing machines to cover all nodes requiring cutting and avoid barrier. Aiming at the characteristics of clearing of young and middle-aged bamboo forests, a Dijkstra and A hybrid algorithm was discussed to solve the path optimization problem in path planning of the bamboo cutting machines. Through C language programming, an imitation model for the path planning system of the young and middle-aged bamboo clearing machine was established based on the improved Dijkstra and A hybrid algorithm, and C++ programming was used to realize the simulation of the system model and call Windows GDI to realize the display of simulation results. The simulation results showed that using the path planning system of the young and middle-aged bamboo clearing machine established in this paper for path planning of the bamboo cutting machine can achieve the goal of the cutting path planning. Compared with the direct cutting path, the total mileage of the bamboo cutting machine was reduced. It saved 47.6% of the total bamboo cutting mileage of the bamboo cutting machine and greatly improved the bamboo cutting efficiency. The improved Dijkstra and A hybrid algorithm discussed in this paper can realize the function of bamboo cutting path planning, and the path planning system can obtain an approximate solution of the optimal bamboo cutting path.

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WANG Hui, CUI Sheng-le, YANG Chun-mei. Design and Computer Simulation of Path Planning System for Bamboo Clearing Machine[J]. Packaging Engineering. 2022(3): 217-227 https://doi.org/10.19554/j.cnki.1001-3563.2022.03.027
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