PDF(57016 KB)
Topology Optimization Design of Bi-Material Free-Layer Damping Treatments
NI Wei-yu, ZHANG Heng, YAO Sheng-wei
Packaging Engineering ›› 2021 ›› Issue (15) : 156-164.
PDF(57016 KB)
PDF(57016 KB)
Topology Optimization Design of Bi-Material Free-Layer Damping Treatments
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