The paper describes the aim at designing a temperature control system of a certain type of spacecraft to meet the requirements of high-precision temperature control. After the design of overall insulation layout and optimization of passive insulation structure and semiconductor temperature control mode is used to analyze steady and transient thermodynamic using ANSYS workbench. The rationality of thermal insulation structure design and thermodynamic analysis is verified thorough tests. Under external thermal load of 36 ℃ and 0 ℃, the temperature inside the packaging container tends to be stable as the distance of the thermal load area moves away. The temperature of the inner loading area can be maintained at 20.99 ℃ and 22.662 ℃. The conclusion is that by optimizing the passive insulation structure of the packaging container and adopting semiconductor precision temperature control, the requirements of miniaturization and high-precision transportation of future spacecraft can be met.