Simulation Analysis and Experimental Study for Headset Drop Impact

LIN Li

Packaging Engineering ›› 2021 ›› Issue (9) : 37-43.

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PDF(53655 KB)
Packaging Engineering ›› 2021 ›› Issue (9) : 37-43. DOI: 10.19554/j.cnki.1001-3563.2021.09.006

Simulation Analysis and Experimental Study for Headset Drop Impact

  • LIN Li
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Abstract

It brings a lot of benefit by predicting the failure before making a prototype. The drop simulation analysis of the headset is carried out with Abaqus, and the impact resistance of the whole structure hitting the ground at a specified height is studied. The material nonlinearity and strain rate effect has been considered, the techniques such as mass scaling and making stress envelope are adopted to improve the efficiency of the simulation. The original design is optimized based on the simulation results, then the simulation result of the final design is compared with the actual drop test result caught by a high-speed photography, the simulation results are highly consistent with the experimental results. This shows that the finite element analysis can effectively shorten the time and reduce the cost of product development, and improve product quality, which is very important for consumer electronic products such as headsets.

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LIN Li. Simulation Analysis and Experimental Study for Headset Drop Impact[J]. Packaging Engineering. 2021(9): 37-43 https://doi.org/10.19554/j.cnki.1001-3563.2021.09.006
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