Simulation Analysis of Projector Transport Packaging Based on Ansys Workbench

SUN De-qiang, SHI Wei, LI Bin, AN Xing, LIU Hong-mei, HAO Jing, LI Guo-zhi

Packaging Engineering ›› 2021 ›› Issue (9) : 11-16.

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Packaging Engineering ›› 2021 ›› Issue (9) : 11-16. DOI: 10.19554/j.cnki.1001-3563.2021.09.002

Simulation Analysis of Projector Transport Packaging Based on Ansys Workbench

  • SUN De-qiang, SHI Wei, LI Bin, AN Xing, LIU Hong-mei, HAO Jing, LI Guo-zhi
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Abstract

This purpose is to design transportation package for a projector and test its protective and safety performance. Modal analysis, random vibration analysis and drop analysis on the projector package is performed with finite element analysis software and tests. In the random vibration simulation analysis, the first six natural frequencies of the package are all greater than 25 Hz, avoiding the resonant frequency range of road and railway transportation, so resonance will not occur. The maximum equivalent stress is 4.628 MPa and the maximum deformation is 1.526 mm. The stress and deformation of each component are within the safe range and meet the requirements of vibration strength. In the drop simulation analysis, the maximum equivalent stress of the lens is 123.49 MPa when the projector falls off, which exceeds the allowable stress of the glass by 28 MPa, so the lens is broken. When the projector transport package drops, the maximum effect force of the lens decreases to 2.1728 MPa, and the stress value of other components does not exceed the yield strength of the corresponding material, which meets the requirements of impact strength. According to the analysis results, the transportation package scheme using EPE foamed plastic and E-type corrugated cardboard is reasonable in structure design, which can protect the projector in the transportation process, and is feasible to some extent.

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SUN De-qiang, SHI Wei, LI Bin, AN Xing, LIU Hong-mei, HAO Jing, LI Guo-zhi. Simulation Analysis of Projector Transport Packaging Based on Ansys Workbench[J]. Packaging Engineering. 2021(9): 11-16 https://doi.org/10.19554/j.cnki.1001-3563.2021.09.002
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