The work aims to summarize the application and progress of boron nitride composites in the packaging field at home and abroad, and forecast the future application of boron nitride materials in packaging. The literature at home and abroad was summarized to briefly introduce basic properties and preparation methods of boron nitride nanosheets (BNNSs) as well as the preparation methods of boron nitride composites. Then, the application and progress of boron nitride composites in the packaging field were sorted out and analyzed emphatically. Boron nitride possessed unique two-dimensional nano-sheet structure and overlapping layer-to-layer structures. BNNSs could not only improve the thermal conductivity, mechanical strength and electrical insulation of composites, but also enhance the barrier properties, mechanical properties, chemical stability and antibacterial properties. Boron nitride composites featured by high thermal conductivity and good electrical insulation can be used in the field of electronic packaging, and have good prospects in the field of flame retardant, antibacterial and anti-corrosive packaging materials.