The work aims to study the influence of temperature and humidity on the mechanical properties of honeycomb paperboard, and to improve the bearing performance and service life of honeycomb paperboard product packaging in high temperature and high humidity environment. Honeycomb paperboards processed at different temperature and humidity parameters were prepared to conduct static compression process. Their stress-strain curves were obtained. The finite element model of the honeycomb paperboard under certain temperature and humidity environment was established, and the finite element simulation analysis was carried out, and the displacement nephogram and stress-strain curve were obtained, and compared with the test results. The results of static compression test were similar to those of finite element analysis, including the stages of elasticity, yield and platform. The stress-strain curves of the test and finite element analysis were consistent. The equivalent elastic modulus and yield stress of honeycomb paperboard were related to temperature and humidity. They decreased with the increase of relative humidity, and increased with the increase of temperature. Experimental research and finite element analysis show that humidity has a significant effect on the mechanical properties of honeycomb paperboard. The research results have important reference value for the load-carrying application of the honeycomb paperboard products.