Molecular Dynamics of Nano Silver Clusters in Conductive Silver Paste

HUANG Hai-yang, LI Yan, XUE Qian

Packaging Engineering ›› 2020 ›› Issue (19) : 122-128.

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PDF(9460 KB)
Packaging Engineering ›› 2020 ›› Issue (19) : 122-128. DOI: 10.19554/j.cnki.1001-3563.2020.19.017

Molecular Dynamics of Nano Silver Clusters in Conductive Silver Paste

  • HUANG Hai-yang1, LI Yan2, XUE Qian2
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Abstract

The paper aims to study the effect of movement mechanism and linker of nano silver clusters on the ag-glomeration. In this paper, the nano silver clusters with different mass ratios were modeled with epoxy as the conductive silver paste connector to simulate the dynamic equilibrium of nano silver clusters with different mass ratios. The nano silver clusters were likely to agglomerate at room temperature. After adding epoxy, the energy of the system was increased, but the movement activity of the silver clusters was obviously decreased. The epoxy adsorbed on the surface of the silver clusters prevented the agglomerating tendency of the silver clusters to some extent. The agglomerating tendency of the silver clusters and the activity of the silver atoms were gradually decreased with the increase of the content of epoxy. The simulation results showed that when the mass fraction of epoxy increased to 33%, the epoxy could prevent the aggregation of silver clusters. In conductive silver paste, nano silver clusters tend to agglomerate at room temperature and are greatly influenced by epoxy.

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HUANG Hai-yang, LI Yan, XUE Qian. Molecular Dynamics of Nano Silver Clusters in Conductive Silver Paste[J]. Packaging Engineering. 2020(19): 122-128 https://doi.org/10.19554/j.cnki.1001-3563.2020.19.017
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