Abstract
For the purpose of improving the packaging efficiency and quality of the flour, the work aims to design and debug the control system of full-automatic flour packaging production line based on the hardware platform of the semi-automatic production line, in order to realize the full-automatic control of the packaging process, centralized monitoring of the upper computer, remote diagnosis and network management, improve the production efficiency of the enterprise and reduce the labor intensity of the workers. According to the technological process of flour packaging production line, combined with the requirements of the enterprise for the remote centralized management of the production process and packaging production line, an intelligent control and management system of full-automatic flour packaging production line based on PLC, touch screen and remote upper computer was built. The core of the control system was Omron CJ2M series PLC. Combined with the Ethernet module and the input and output module, the MT6070iH touch screen on the panel was used to locally monitor and control the operation status of the whole packaging production line. The KingView 6.52 software was used to complete the construction of remote upper computer, so as to remotely monitor and centrally manage the operation process of flour packaging production. It had been proved that, compared with the traditional manual or semi-automatic packaging mode, the full-automatic flour packaging machine that applied PLC technology and the remote management and monitoring system of the upper computer had such advantages as strong stability, low cost and flexibility, which greatly improved the packaging efficiency of flour and the level of intelligent production management of the enterprise. After the control system is built and debugged, it can control, monitor and manage the full-automatic flour packaging production process locally and remotely.
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CAO Hong-ying, WANG Li, YAO Jia-chen.
Design of Control System on Full-automatic Flour Packaging Production Line[J]. Packaging Engineering. 2020(15): 215-221 https://doi.org/10.19554/j.cnki.1001-3563.2020.15.032
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