Drop Kinetics Simulation of a Packaging Box

YUAN Hui-qun, FU Fan, YANG Shu-liang, QIN Jun-sheng

Packaging Engineering ›› 2020 ›› Issue (11) : 72-77.

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Packaging Engineering ›› 2020 ›› Issue (11) : 72-77. DOI: 10.19554/j.cnki.1001-3563.2020.11.011

Drop Kinetics Simulation of a Packaging Box

  • YUAN Hui-qun1, FU Fan2, QIN Jun-sheng2, YANG Shu-liang3
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Abstract

The work aims to study the impact dynamic responses of a new missile packaging box under drop condition and check whether the box structure meets the design requirements. The finite element simulation technique was used to investigate the dynamic behavior of packaging box with drop impact. The three-dimensional simulation models of the box were established. Level drop and edge drop were analyzed, respectively. The stress distribution and acceleration response of the box were obtained, and the reliability of the simulation analysis results was verified by experiment. The maximum stress on the box was less than the yield limit of the material under the two drop conditions. After drop experiment, it could be found that the box had no damage and deformation, which agreed well with the simulation results. The finite element analysis results are reasonable and reliable, and the structural property of the packaging box satisfies the design requirements.

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YUAN Hui-qun, FU Fan, YANG Shu-liang, QIN Jun-sheng. Drop Kinetics Simulation of a Packaging Box[J]. Packaging Engineering. 2020(11): 72-77 https://doi.org/10.19554/j.cnki.1001-3563.2020.11.011
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