Packing Structure of Pallet-free Bricks Stack Based on Ansys Workbench

TIAN Gao, LIU Hong-mei, NI Hong-jun, LYU Shuai-shuai, WANG Xing-xing, ZHANG Jian, AI Wen-bo

Packaging Engineering ›› 2020 ›› Issue (5) : 178-184.

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PDF(8130 KB)
Packaging Engineering ›› 2020 ›› Issue (5) : 178-184. DOI: 10.19554/j.cnki.1001-3563.2020.05.025

Packing Structure of Pallet-free Bricks Stack Based on Ansys Workbench

  • TIAN Gao, LIU Hong-mei, NI Hong-jun, LYU Shuai-shuai, WANG Xing-xing, ZHANG Jian, AI Wen-bo
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Abstract

The paper aims to study the safety and reliability of the pallet-free brick stack packaging structure with finite element software. Theoretical analysis and finite element simulation of static state and transition state of the brick stacks were carried out. The model created in SolidWorks was imported into Ansys Workbench for analysis to obtain a finite element model. The simulation results were obtained by applying different loads and different constraints. When the brick stack was placed under static load, the maximum strain and stress of the brick were concentrated on the second layer of the bricklayer from the bottom of the forklift hole; during the transfer process, the maximum strain and stress of the brick were still concentrated at this bottom, and the tendency of extrusion and crushing was generated; during the transfer of the brick stack, the maximum deformation was concentrated at the elevation of the bottom of the brick and the vertical direction was close to the forklift hole. The stress of the strapping tape reached 41.2% of the allowable value. In this kind of packing mode, although the brick stack has a tendency of lateral extrusion at the position of the forklift hole, but it does not exceed the strength range of the brick. The strapping tape is still in the allowable range. It can still fit the needs of this kind of packaging and stacking.

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TIAN Gao, LIU Hong-mei, NI Hong-jun, LYU Shuai-shuai, WANG Xing-xing, ZHANG Jian, AI Wen-bo. Packing Structure of Pallet-free Bricks Stack Based on Ansys Workbench[J]. Packaging Engineering. 2020(5): 178-184 https://doi.org/10.19554/j.cnki.1001-3563.2020.05.025
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