Research Progress of Thermal Conductive Polymer Materials in Packaging and Printing

XIANG Yun, ZHI Qing-ke, LUO Hong-yan, PEI Jin-long, GAO Yan-fei

Packaging Engineering ›› 2020 ›› Issue (5) : 148-157.

PDF(337 KB)
PDF(337 KB)
Packaging Engineering ›› 2020 ›› Issue (5) : 148-157. DOI: 10.19554/j.cnki.1001-3563.2020.05.021

Research Progress of Thermal Conductive Polymer Materials in Packaging and Printing

  • XIANG Yun1, ZHI Qing-ke1, LUO Hong-yan1, PEI Jin-long1, GAO Yan-fei2
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Abstract

The paper aims to summarize the application of thermal polymer materials in packaging and printing to expand the application of thermal conductive polymer materials. Firstly, the preparation methods of two types of thermal conductive polymer materials, namely, intrinsic and filled thermal polymer materials, were introduced. Secondly, the thermal conductive film/paper, thermal conductive adhesive and thermal conductive ink used in packaging and printing were reviewed. Finally, the common types of thermal conductivity mechanism models were summarized. Compared with the intrinsic thermal polymer materials, the filled thermal polymer materials had the advantages of simple processing, low cost and wide application. It is the most researched thermal conductive polymer material at present. Thermal conductive film/paper, thermal conductive adhesive and thermal conductive ink had extensive research bases and strong market demand. The thermal conductivity prediction model can effectively predict the thermal conductivity of the composite, but it was affected by the filler content and particle morphology. Thermally conductive polymer materials have great application requirements in packaging and printing. It is of great practical and theoretical significance to research thermal conductive polymers.

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XIANG Yun, ZHI Qing-ke, LUO Hong-yan, PEI Jin-long, GAO Yan-fei. Research Progress of Thermal Conductive Polymer Materials in Packaging and Printing[J]. Packaging Engineering. 2020(5): 148-157 https://doi.org/10.19554/j.cnki.1001-3563.2020.05.021
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