Dynamic Simulation of a New Structure Missile Packing Box-frame

SUN Hong-yun, WANG Guang-ding, YUAN Hui-qun, TAO Wen-bin, LIU Zhi-min

Packaging Engineering ›› 2019 ›› Issue (17) : 104-109.

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Packaging Engineering ›› 2019 ›› Issue (17) : 104-109. DOI: 10.19554/j.cnki.1001-3563.2019.17.015

Dynamic Simulation of a New Structure Missile Packing Box-frame

  • SUN Hong-yun1, WANG Guang-ding1, YUAN Hui-qun2, TAO Wen-bin3, LIU Zhi-min4
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Abstract

This paper aims to study the dynamic response of a new structure missile packing box-frame. A dynamic model of packing box-frame was established. Finite element (FE) and experimental approaches were applied to analyze the transient dynamics under the combined lifting condition. The stress results of the missile packing box-frame were obtained. The maximum stress of the box-frame system when lifting by 1×4 stacking and 2×2 stacking modes was 78 MPa and 158 MPa respectively. The maximum stress level box-frame system when lifting by 1×4 stacking mode was significantly lower than the maximum stress level when lifting by 2×2 stacking mode. The maximum stress in the process of lifting was obviously less than the yield stress of the material under these cases. When the system was lifted under 2.5g hoisting load, the structure not suffered from strength failure. The outer structure of the packing box-frame is intact without damage, crack or permanent deformation after lifting.

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SUN Hong-yun, WANG Guang-ding, YUAN Hui-qun, TAO Wen-bin, LIU Zhi-min. Dynamic Simulation of a New Structure Missile Packing Box-frame[J]. Packaging Engineering. 2019(17): 104-109 https://doi.org/10.19554/j.cnki.1001-3563.2019.17.015
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