PDF(454 KB)
Effects of Testing Device and Method Conditions on Puncture Resistance of Film
CHEN Xin, CHENG Xiang-yu, ZHOU Jia-yan, GAO Cui-ling, HE Xiang-ke, YU Jia-jia
Packaging Engineering ›› 2019 ›› Issue (9) : 53-58.
PDF(454 KB)
PDF(454 KB)
Effects of Testing Device and Method Conditions on Puncture Resistance of Film
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