This paper introduced the basic research progress of boron nitride (BN) filled thermal conductive composites from four aspects: surface modification, orientation structure, morphology and content of BN filler as well as hybrid fillers, which provided some research ideas for application of thermal conductive polymers in the field of electronic packaging. Based on analysis and summary of the related literatures at home and abroad in recent years, the industrial preparation methods and product properties of micro/nano BN were summarized. Then, the research progress of micro/nano-BN fillers on the thermal conductivity of polymer matrix composites was introduced. Then the thermal conducting mechanism of the composites was discussed. The excellent properties of BN make it possible to prepare filled high thermal conductive composites.