Transportation Package Design and Finite Element Analysis of Tempered Glass

LI Chen, NIU Mei-liang, ZHAO Yu-song

Packaging Engineering ›› 2018 ›› Issue (15) : 113-118.

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PDF(2323 KB)
Packaging Engineering ›› 2018 ›› Issue (15) : 113-118. DOI: 10.19554/j.cnki.1001-3563.2018.15.017

Transportation Package Design and Finite Element Analysis of Tempered Glass

  • LI Chen, NIU Mei-liang, ZHAO Yu-song
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Abstract

The work aims to design safe and reasonable transportation package, and conduct the finite element analysis on its protection performance, with tempered glass as the research object. Packaging materials were chosen to design the structure and size of each component of the transportation package. Pro/E was used to establish the transportation package model. The static stacking load simulation analysis, modal simulation analysis and random vibration simulation analysis were carried out with the Ansys Workbench model. The maximum equivalent stress resulting from the static stacking simulation occurred at the pine pallet, and it was 0.506 MPa and far less than the yield limit (10.47 MPa) of pine. The maximum equivalent strain was 0.0044, which was 2.31 mm converted into package deformation, and it was less than the allowable package deformation value (4.2 mm). The modal simulation analysis showed that the operating frequency of the package was 42.2, 44.8, 51.2, 52.6, 69.5 and 69.8 Hz, which avoided the resonance frequency (2 Hz and 10 Hz) of the automobile on road. In the random vibration simulation analysis, the displacement of the package in the y direction was 0.037 mm, which was much smaller than the allowable package deformation value. Through simulation analysis, it can be determined that the designed transportation package scheme of the tempered glass is reasonable, which can effectively protect the tempered glass during transportation.

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LI Chen, NIU Mei-liang, ZHAO Yu-song. Transportation Package Design and Finite Element Analysis of Tempered Glass[J]. Packaging Engineering. 2018(15): 113-118 https://doi.org/10.19554/j.cnki.1001-3563.2018.15.017
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