Abstract
The work aims to study the workable application method of energy absorption diagram in honeycomb paperboard. The same example was analyzed through the method of constructing the energy absorption diagram with the envelope of the shoulder and the method of forming energy absorption diagram by the connection of yield corresponding points. The best thickness of honeycomb cardboard and the thickness of single layer core paper were obtained respectively. Then, the two different honeycomb paperboards were compressed with the maximum allowable stress of the product and the compressive deformation was viewed. The maximum deformation mode, the variation curve of the kinetic energy of the product, the displacement curve and the acceleration change curve were also examined by the drop method. The feasibility of these two methods was examined through the aforesaid analysis and comparison. The optimization results were obtained by the method of shoulder point. Because the maximum allowable stress of the product was less than the yield stress of the honeycomb paperboard, the honeycomb paperboard could not be deformed to absorb energy of the product's drop impact, thus causing the product to be damaged due to the excessively large response acceleration of the product. The optimization results were obtained by the method of yield corresponding point. Because the maximum allowable stress of the product could overcome the yield stress of the honeycomb paperboard, so that the honeycomb paperboard could be deformed to absorb the energy, absorb all the energy before reaching the maximum allowable stress of the product and protect the product effectively. On the basis of not considering the actual safety factor, the proposed yield corresponding point method has the maximum allowable stress of the product corresponded to the yield stress of the cushioning material. The optimized material obtained can effectively protect the product from the buffering.
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SONG Wei-sheng.
Application of Energy Absorption Diagram in Honeycomb Paperboard[J]. Packaging Engineering. 2018(15): 15-20 https://doi.org/10.19554/j.cnki.1001-3563.2018.15.003
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