The Design of Temperature and Liquid Level Monitoring Module for Intelligent Packaging

NIE Ying, LUO Qin, CHEN Yu-qiang

Packaging Engineering ›› 2018 ›› Issue (11) : 40-47.

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PDF(3427 KB)
Packaging Engineering ›› 2018 ›› Issue (11) : 40-47. DOI: 10.19554/j.cnki.1001-3563.2018.11.008

The Design of Temperature and Liquid Level Monitoring Module for Intelligent Packaging

  • NIE Ying1, LUO Qin2, CHEN Yu-qiang3
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Abstract

The work aims to study the temperature and liquid level monitoring model of information-based intelligent packaging starting from the definition of intelligent packaging. Through the definition of intelligent packaging, a multi-function insulated milk bottle was designed, with AT89C52 CSM as the core, and added with power module, temperature sensor, liquid level sensor and automatic control heating module; and the specific practical examples were given. The temperature and liquid level monitoring module was applied in the bottle packaging. The data line was embedded by means of the insulation layer gap of the milk bottle, and the output of the single chip microcomputer was transmitted to the LCD1602 display screen mounted on the top of the bottle lid by the data line. The proposed method enables the user to timely observe the temperature and residual quantity of milk on the display screen of the bottle lid, and the intelligent packaging of the bottle can be realized.

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NIE Ying, LUO Qin, CHEN Yu-qiang. The Design of Temperature and Liquid Level Monitoring Module for Intelligent Packaging[J]. Packaging Engineering. 2018(11): 40-47 https://doi.org/10.19554/j.cnki.1001-3563.2018.11.008
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