The work aims to conduct the microscale design of electronic tag on the outer package so as not to affect the overall structure and way of packaging of the outer package, and analyze the reliability of electronic tag housing with respect to the situation that the housing might be damaged due to the special external circumstances. The compression and impact resistance of the housing designed based on the principle of space maximization through the Ansys software were simulated and analyzed. Under the 2 MPa pressure applied in the z direction, the maximum deformation was 2.8 mm, which could not meet the compression resistance requirements. Then, the housing design scheme based on the principle of structural optimization was put forward. After simulation analysis, the maximum deformation of the housing under a static pressure of 2 MPa applied in the z direction was 0.2 mm, 2.6 mm lower than that before the optimization. After optimized, the intelligent electronic tag is featured by micromation and high reliability, and meets the application requirements of the system.