异形网格包装板设计及其振动声辐射特性仿真分析

谭伟超, 刘子贵, 潘志轩, 赖信宇

Design and Simulation Analysis of Vibration and Sound Radiation Characteristics of Irregular Grid Packaging Boards

TAN Weichao, LIU Zigui, PAN Zhixuan, LAI Xinyu

包装工程（技术栏目） . 2026, (7): 300 -306 . DOI: 10.19554/j.cnki.1001-3563.2026.07.034