基于改进YOLOv5的轻量级芯片封装缺陷检测方法

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赖武刚, 李家楠, 林凡强

Lightweight Chip Package Defect Detection Method Based on Improved YOLOv5

LAI Wu-gang, LI Jia-nan, LIN Fan-qiang

. 2023, (17): 189 -196 . DOI: 10.19554/j.cnki.1001-3563.2023.17.023