LOCA条件下包壳材料感应和电阻加热温升行为的对比研究

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YAO Liang, CHENG Ren-shan, WU Lu, ZHANG Wei, MEI Rui-bin, PAN Hu-cheng

. 2020, (9): 91 -99 . DOI: 10.19554/j.cnki.1001-3563.2020.09.014