目的 为柔性高阻隔薄膜的应用提供理论指导。方法 综述柔性高阻隔膜的应用现状及存在问题，总结热蒸发、化学气相沉积、原子层沉积等制备柔性高阻隔薄膜的方法、原理、特点及应用，展望高阻隔膜包装材料的发展前景。结果 高阻隔薄膜制备工艺趋向于单次制备，采用等离子体辅助原子层沉积技术是制备超高阻隔薄膜的首选，原子层沉积（ALD）和分子层沉积（MLD）结合也是获得超高阻隔薄膜的未来发展方向。结论 快速、高效地制备柔性高阻隔薄膜是包装工业的发展趋势。

The work aims to provide the theoretical guidance for the application of the flexible high barrier films. The application status and existing problems of flexible high barrier film were summarized. The fabrication methods (such as thermal evaporation, chemical vapor deposition and atomic layer deposition (ALD)), principles, characteristics and application of the flexible high barrier films were summed up. The development prospect of the high barrier film packaging materials wasforecasted. The preparation technology of highbarrier film tended to be a singlestep. The use of plasma-assisted ALD technique was the first choice for the preparation of ultra-high barrier film. The combination of ALD and molecular layer deposition (MLD) was the future development direction to obtain the ultra-high barrier film. Rapid and efficient preparation of flexible high barrier film is the development trend in packaging industry.