目的 研究液晶环氧树脂改性E-51树脂体系的黏度和固化动力学， 为发射箱湿法缠绕成形提供理论依据。方法 采用旋转黏度计测试树脂体系在25， 30和35 ℃下的静态黏度， 用非等温DTA法研究树脂体系固化动力学， 并用T-β外推法推导固化工艺参数。结果 在25， 30和35 ℃下， 8 h后树脂体系的黏度分别为1219， 1568和1789 mPa·s； 固化工艺参数为Ti=71 ℃， Tp=131 ℃， Tf=181 ℃， 并获得了固化动力学方程。结论 树脂体系黏度小于2 Pa·s， 满足发射箱湿法缠绕工艺要求， 固化工艺制度为70， 100，130和180 ℃下分别恒温固化2 h。

In order to provide theoretical basis for wet winding of the launch box, the article studied the viscosity and curing kinetics of E-51 resin system modified by liquid epoxy resin. The static viscosity of resin system at 25 ℃, 30 ℃ and 35 ℃ was tested by rotational viscometer, the non-isothermal curing kinetics of resin system was studied by DTA, and the parameters of the curing process were derived by T-β extrapolation. The viscosity of the resin system at 25 ℃, 30 ℃ and 35℃ respectively was 1219 mPa·s, 1568 mPa·s and 1789 mPa·s after 8 h, respectively. The curing process parameters were Ti =71 ℃， Tp =131 ℃， Tf =181 ℃. The curing kinetics equation was obtained. The viscosity of resin system was less than 2 Pa·s, meeting the process requirement of wet winding of the launch box. The curing process was curing at constant temperatures of 70 ℃,100 ℃,130 ℃and 180 ℃ for 2 h, respectively.