基于SolidWorks 96 孔薄膜热封板温度场模拟与优化设计

魏银文, 朱磊, 高贯虹

包装工程(技术栏目) ›› 2013 ›› Issue (17) : 9-11.

包装工程(技术栏目) ›› 2013 ›› Issue (17) : 9-11.

基于SolidWorks 96 孔薄膜热封板温度场模拟与优化设计

  • 魏银文1, 朱磊1, 高贯虹2
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Temperature Field Simulation and Optimization Design of 96-hole Thin-film Heat-sealing Plate Based on SolidWorks

  • WEI Yin-wen1, ZHU Lei1, GAO Guan-hong2
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摘要

针对生化分析领域96 孔样品池薄膜热封的热封板温度场分布问题,运用SolidWorks 三维软件进行建模,并运用插件Simulation 对其施行有限元分析和优化设计。首先,对现有的薄膜热封板进行了建模仿真分析,其次经过实验验证,得出模拟数据与实测数据吻合,说明该模拟仿真的思路和方法适合于优化此类非等温平板的传热问题的。最后通过对热封板中的电热丝不同排布及不同排布方式中电热丝绕行间距的调整,使得优化设计方案达到热板表面最大温差在±1 ℃以内。

Abstract

In order to solve the problem of the 96-hole thin film heat-sealing plate's temperature field distribution in the field of biochemical analysis, SolidWorks 3D modeling software with its plug-ins Simulation was applied to analyze and design the heat plate. Simulation analysis was carried out on the existing thin-film heat sealing plate. The simulation data were verified with experiment. The results showed that simulation data coincide with experimental data, which prove that the idea and method is suitable for simulation to optimize such non-isothermal plate. The heating wire arrangement in the plate was adjusted according to the simulation, which reduce the maximum temperature difference on the surface of the hot plate within ±1 ℃.

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魏银文, 朱磊, 高贯虹. 基于SolidWorks 96 孔薄膜热封板温度场模拟与优化设计[J]. 包装工程(技术栏目). 2013(17): 9-11
WEI Yin-wen, ZHU Lei, GAO Guan-hong. Temperature Field Simulation and Optimization Design of 96-hole Thin-film Heat-sealing Plate Based on SolidWorks[J]. Packaging Engineering. 2013(17): 9-11

基金

江苏省科技支撑计划(BE2011652)

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