首先叙述了防静电包装与防静电包装材料的概念,对微电子产品的防静电包装设计进行了介绍,并分别讨论了不同种类的抗静电包装材料的特点,简述了微电子产品包装国内外的发展情况,最后指出了微电子产品防静电包装的发展趋势与良好的市场前景。

The concept of anti-static packaging and anti-static packaging material were first described. Anti-static packaging design for microelectronic products was introduced. The characteristics of different types of anti-static packaging material were discussed. Development status of anti-static packaging for microelectronic products at home and abroad was introduced. Development trend and market prospects of anti-static packaging for microelectronic products were put forward.