DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为

张天才; 王永凤; 张凯; 杨骐; 刘孝会; 王艳艳

包装工程（技术栏目） ›› 2013 ›› Issue (7) : 7-9.

张天才¹, 王永凤¹, 杨骐¹, 刘孝会¹, 王艳艳¹, 张凯²

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Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry

ZHANG Tian-cai¹, WANG Yong-feng¹, YANG Qi¹, LIU Xiao-hui¹, WANG Yan-yan¹, ZHANG Kai²

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摘要

采用示差扫描量热法(DSC),在 25 ~ 230 ℃范围内以不同的升温速率(5,10,15, 20 ℃ / min),研究了以聚醚胺 / 酚醛胺为固化剂的环氧树脂体系的固化行为,对其不同升温速率下的固化度进行了分析,采用 T-β 外推法得出了该体系的起始固化温度、峰顶固化温度和终止固化温度等固化工艺参数。

Abstract

Curing behavior of polyether amine / phenolic amine-epoxy resin system was studied using DSC at heating rates of 5, 10, 15 and 20 ℃ / min from 25 ℃ to 230 ℃ , and the curing states were analyzed in different heating rates. At last, initial curing temperature, maximum curing temperature, and terminal curing temperature were calculated by extrapolating T-β.

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张天才, 王永凤, 张凯, 杨骐, 刘孝会, 王艳艳. DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为[J]. 包装工程（技术栏目）. 2013(7): 7-9

ZHANG Tian-cai, WANG Yong-feng, ZHANG Kai, YANG Qi, LIU Xiao-hui, WANG Yan-yan. Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry[J]. Packaging Engineering. 2013(7): 7-9