为正确评估跌落冲击对箱装电子仪器可靠性的影响，确定了合理的包装参数和设计流程，科学指导运输与试验，分别采用理论分析和有限元计算方法对箱装电子仪器垂直跌落的情况进行了仿真，得到了垂直跌落条件下电子仪器最大加速度和最大位移随跌落高度与缓冲垫弹性模量变化的规律。结合产品脆值，确定了产品储运过程中的最大堆垛高度，并得到了合理的包装设计流程，从而为有效指导产品包装设计、实体试验和储运安全提供了理论依据。

Vertical drop in packaging electronic instruments was simulated using theory and finite element analysis to correctly assess the influence drop impact on reliability of electronic instruments, determine logical packing parameters and design process, guide transportation and experiment scientifically. The changing law of maximal acceleration and maximal displacement of electronic instruments with drop height and elastic modulus of buffer under vertical drop condition was obtained. The maximal height of products in storage and transportation was determined. Logical packaging design process was obtained. The purpose was to provide reference for packaging design, full-scale experiment and safety of storage and transportation.