基于v4插值算法的墨量在线检测研究

杨 华, 刘 真

包装工程(技术栏目) ›› 2011 ›› Issue (17) : 102-104.

包装工程(技术栏目) ›› 2011 ›› Issue (17) : 102-104.

基于v4插值算法的墨量在线检测研究

  • 杨 华, 刘 真
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Research on Ink On-line Testing Based on v4 Interpolation Algorithm

  • YANG Hua, LIU Zhen
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摘要

采用IGT模拟平版印刷的实验,建立了3种墨层厚度与光学密度的转换模型,依据模型的MAE和RMSE值,采用T-E模型,获得了多种油墨纸张组合的最佳墨层厚度范围。通过v4插值算法建立了CCD响应值与墨层厚度范围的三维模型,以实现墨量在线检测,并以测试样张的CCD响应值是否对应于最佳墨层厚度范围,验证了模型的准确性。

Abstract

Three kinds of ink film thickness and optical density conversion model were established through simulating offset print with IGT. According to the MAE and RMSE values, by using Tollenar-Erns model, the best range of ink film thickness of different paper and ink's combination were solved. A three dimensional model of CCD signal acquisition values and ink film thickness was set up by using v4 interpolation algorithm to realize ink on-line testing. The model's accuracy was validated by testing sample's CCD signal acquisition values on the correspondence to the best range of ink film thickness.

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杨 华, 刘 真. 基于v4插值算法的墨量在线检测研究[J]. 包装工程(技术栏目). 2011(17): 102-104
YANG Hua, LIU Zhen. Research on Ink On-line Testing Based on v4 Interpolation Algorithm[J]. Packaging Engineering. 2011(17): 102-104

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