基于半圆拱形晶格的3D打印缓冲材料制备优化与力学性能研究

潘羽珏, 林乐豪, 张改梅, 刘辉, 石佳子, 鲁建东, 夏家良

包装工程(技术栏目) ›› 2026, Vol. 47 ›› Issue (13) : 99-106.

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包装工程(技术栏目) ›› 2026, Vol. 47 ›› Issue (13) : 99-106. DOI: 10.19554/j.cnki.1001-3563.2026.13.012
高性能纤维及其复合材料在防护与包装中的应用

基于半圆拱形晶格的3D打印缓冲材料制备优化与力学性能研究

  • 潘羽珏1, 林乐豪1, 张改梅1*, 刘辉1, 石佳子1, 鲁建东1, 夏家良2
作者信息 +

Preparation Optimization and Mechanical Properties of 3D-printed Cushioning Materials Based on Semicircular Arch Lattices

  • PAN Yujue1, LIN Lehao1, ZHANG Gaimei1*, LIU Hui1, SHI Jiazi1, LU Jiandong1, XIA Jialiang2
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摘要

目的 针对传统石油基发泡缓冲材料定制化程度低、六边形蜂窝结构棱角处应力集中易突发失效等问题,开发低应力集中、可数字化定制的新型结构缓冲材料。方法 以热塑性聚氨酯(Thermoplastic polyurethane,TPU)为基材,采用熔融沉积成型(Fused deposition modeling,FDM)3D打印技术制备半圆相切拓扑晶格材料,通过准静态压缩试验探究孔径、厚度及压缩方向对其力学性能的调控规律。结果 该结构呈现典型的线弹性-屈服平台-密实化三阶段力学特征,平台应力波动<10%;孔径为核心调控参数,峰值应力可在0.326~2.467 MPa范围适配;增大厚度使平台应变跨度最大提升28.89%,总吸能提升69.56%;孔径为40 mm、厚度为40 mm的试样水平方向最小缓冲系数达2.23。结论 该半圆晶格结构有效缓解应力集中,兼具优异缓冲效率与定制化优势,为缓冲包装结构优化设计提供理论支撑与技术路径。

Abstract

The work aims to develop a novel structural cushioning material with low stress concentration and digital customizability to address such issues as the low customizability of traditional petroleum-based foam cushioning materials and the susceptibility of hexagonal honeycomb structures to premature failure caused by stress concentration at their edges and corners. With thermoplastic polyurethane (TPU) as the base material, semicircular tangent topological lattices were fabricated via fused deposition modeling (FDM) 3D printing, and quasi-static compression tests were performed to examine the effects of pore size, thickness and compression direction on mechanical properties. The structure showed a typical three-stage mechanical behavior (linear elasticity, yield plateau, densification) with plateau stress fluctuation <10%. Pore size was the core parameter, tuning peak stress from 0.326 to 2.467 MPa. Increasing thickness extended plateau strain span by 28.89% and total energy absorption by 69.56%. The 40 mm pore size, 40 mm thickness sample achieved a minimum horizontal cushioning coefficient of 2.23. In conclusion, this semicircular lattice effectively mitigates stress concentration, combines excellent cushioning efficiency with customizability, and provides theoretical support and technical approaches for the structural optimization design of cushioning packaging.

关键词

3D打印 / 半圆晶格结构 / 准静态压缩 / 缓冲性能 / 能量吸收

Key words

3D printing / semicircular lattice structure / quasi-static compression / buffer performance / energy absorption

引用本文

导出引用
潘羽珏, 林乐豪, 张改梅, 刘辉, 石佳子, 鲁建东, 夏家良. 基于半圆拱形晶格的3D打印缓冲材料制备优化与力学性能研究[J]. 包装工程. 2026, 47(13): 99-106 https://doi.org/10.19554/j.cnki.1001-3563.2026.13.012
PAN Yujue, LIN Lehao, ZHANG Gaimei, LIU Hui, SHI Jiazi, LU Jiandong, XIA Jialiang. Preparation Optimization and Mechanical Properties of 3D-printed Cushioning Materials Based on Semicircular Arch Lattices[J]. Packaging Engineering. 2026, 47(13): 99-106 https://doi.org/10.19554/j.cnki.1001-3563.2026.13.012
中图分类号: TB485.1   

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基金

河北省省级科技计划项目(25361202D);智能与绿色柔版印刷重点实验室课题(ZBKT201810,ZBKT2502)

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