包装有限元仿真应用研究进展

赵吉中; 邓依; 叶根军; 杨多兵; 李霜; 江昆阳; 梁盛华; 安明哲

doi:10.19554/j.cnki.1001-3563.2026.05.031

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包装工程（技术栏目） ›› 2026, Vol. 47 ›› Issue (5) : 303-316. DOI: 10.19554/j.cnki.1001-3563.2026.05.031

绿色包装与循环经济

包装有限元仿真应用研究进展

赵吉中^a, 邓依^b, 叶根军^a,*, 杨多兵^a, 李霜^b, 江昆阳^c, 梁盛华^a, 安明哲^b,c

作者信息 +

Research Progress of Finite Element Simulation Application for Packaging

ZHAO Jizhong^a, DENG Yi^b, YE Genjun^a,*, YANG Duobing^a, LI Shuang^b, JIANG Kunyang^c, LIANG Shenghua^a, AN Mingzhe^b,c

Author information +

文章历史 +

摘要

目的归纳包装有限元仿真应用现状、挑战及趋势,为该领域后续研究和应用提供参考。方法从静态与准静态、动态与冲击响应、热、多物理场耦合、轻量化与结构优化及其他仿真等方向梳理包装有限元仿真应用研究现状,统计领域内仿真软件使用情况,给出包装有限元仿真辅助包装设计应用流程,分析现存挑战,展望未来趋势。结果包装有限元仿真应用主要以跌落冲击仿真为主、其他仿真协同发展;ANSYS、ABAQUS、MSC、HyperWorks、COMSOL、PAM-CRASH等为该领域核心软件工具;当前包装有限元仿真应用存在材料本构模型精度低、多物理场耦合仿真复杂度高、网格划分与模型构建难度大、计算资源与效率存在瓶颈、实际工况与仿真边界条件不统一、成本与人才门槛高等问题。结论未来包装有限元仿真应用将朝着智能化/精准化的材料模型、多物理场耦合仿真工程化应用、构建高保真精细仿真模型、绿色与可持续包装仿真优化、仿真工具集成与生态化等方向发展。

Abstract

The work aims to comprehensively summarize the current application status, challenges, and future trends of finite element (FE) simulation in packaging, providing reference for subsequent research and application in this field. The research progress was reviewed from static and quasi-static analysis, dynamic impact response, thermal behavior, multi-physics coupling, lightweight design and structural optimization, and other emerging simulation directions. Furthermore, a statistical analysis was performed on the application characteristics of simulation software in the field, presenting the application workflow of packaging finite element simulation in aiding packaging design, analyzing existing challenges and forecasting future trends. The results indicated that drop impact simulation was the primary application direction, while other simulation fields were progressively evolving. ANSYS, ABAQUS, MSC, HyperWorks, COMSOL, and PAM-CRASH were identified as the core software tools widely used in this field. Currently, several critical challenges exist in the application of packaging FE simulation, such as the low accuracy of material constitutive models, the high complexity of multi-physics coupling simulations, difficulties in mesh generation and model construction, bottlenecks in computational resources and efficiency, inconsistencies between actual working conditions and simulation boundary conditions, as well as high costs and steep talent thresholds. In the future, packaging FE simulation is expected to evolve toward intelligent and high-precision material models, the engineering application of multi-physics coupling simulations, the construction of high-fidelity refined simulation models, the simulation optimization for green and sustainable packaging, and the integration of simulation tools as well as ecosystem development.

导出引用

赵吉中, 邓依, 叶根军, 杨多兵, 李霜, 江昆阳, 梁盛华, 安明哲. 包装有限元仿真应用研究进展[J]. 包装工程. 2026, 47(5): 303-316 https://doi.org/10.19554/j.cnki.1001-3563.2026.05.031

ZHAO Jizhong, DENG Yi, YE Genjun, YANG Duobing, LI Shuang, JIANG Kunyang, LIANG Shenghua, AN Mingzhe. Research Progress of Finite Element Simulation Application for Packaging[J]. Packaging Engineering. 2026, 47(5): 303-316 https://doi.org/10.19554/j.cnki.1001-3563.2026.05.031

中图分类号： TB48 TP391.9

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