基于纸基微流控芯片的防伪无废弃包装

杨晨, 雷文财

包装工程(技术栏目) ›› 2024 ›› Issue (13) : 98-103.

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包装工程(技术栏目) ›› 2024 ›› Issue (13) : 98-103. DOI: 10.19554/j.cnki.1001-3563.2024.13.012

基于纸基微流控芯片的防伪无废弃包装

  • 杨晨, 雷文财
作者信息 +

Anti-counterfeit and Waste-free Packaging Based on Paper-based Microfluidic Chip

  • YANG Chen, LEI Wencai
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摘要

目的 在当今环保意识不断增强的背景下,纸基微流控技术以其低成本、可降解的特点,逐渐成为包装行业的研究热点。本研究旨在设计一种基于纸基微流控芯片的多功能包装,通过碳点的特异性荧光响应实现防伪功能,并结合导电油墨器件添加趣味教学功能,以满足现代环境的无废弃包装要求。方法 通过丝网印刷的方法,构建荧光传感与导电油墨器件一体化的纸基微流控芯片,粘贴在传统纸质包装的内表面制备具有防伪功能的无废弃包装。结果 经测试,该包装可以通过碳点材料的荧光与猝灭鉴别产品真伪,并在滴入导电油墨后通过发光器件起到趣味教学的作用。结论 将纸基微流控芯片与纸质包装相结合,为产品防伪与包装可持续应用提供了一种可行的方法。

Abstract

In the context of the growing awareness of environmental protection today, paper-based microfluidic technology, characterized by low cost and biodegradability, has gradually become a hot topic of research in the packaging industry. The work aims to design multifunctional packaging utilizing paper-based microfluidic chip technology, which utilizes the unique fluorescent response of carbon dots for anti-counterfeiting purposes and integrates a teaching component through the use of conductive ink devices to meet the contemporary environmental standards for waste-free packaging materials. Through the utilization of silk screen printing technique, a paper-based microfluidic chip integrating fluorescent sensing and conductive ink components was fabricated, adhered onto the inner surface of conventional paper packaging to create waste-free anti-counterfeit packaging. This integration allowed for product authenticity verification under UV light irradiation and offered an educational dimension through luminescence demonstration post-application of conductive ink. The fusion of paper-based microfluidic chips with paper packaging presents a viable approach for enhancing product security and promoting sustainable packaging practices.

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杨晨, 雷文财. 基于纸基微流控芯片的防伪无废弃包装[J]. 包装工程(技术栏目). 2024(13): 98-103 https://doi.org/10.19554/j.cnki.1001-3563.2024.13.012
YANG Chen, LEI Wencai. Anti-counterfeit and Waste-free Packaging Based on Paper-based Microfluidic Chip[J]. Packaging Engineering. 2024(13): 98-103 https://doi.org/10.19554/j.cnki.1001-3563.2024.13.012

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