目的 开发控温包装传热仿真系统Tpackage，通过参数化建模和传热仿真，对控温包装的保温效果进行有效分析。方法 以典型控温包装为研究对象，基于OpenCASCADE、QT与VTK设计控温包装参数化建模模块;分析包装内外热量传递规律，开发控温包装传热求解器模块。集成2个模块实现控温包装的参数化建模和传热过程的数值模拟。结果 使用Tpakcage在30、40 ℃ 2个环境温度下对2套控温包装系统(TC1、TC2)进行传热仿真，并采用Comsol进行同条件模拟，产品测温点到达8 ℃所经过时间的最大误差分别为7.04%(TC1-30 ℃)、9.87%(TC1-40 ℃)、8.82%(TC2-30 ℃)、9.73%(TC2-40 ℃);在30 ℃条件下进行实际验证实验，通过Tpackage进行同条件对比验证，产品测温点到达8 ℃所用时间的最大误差为9.47%。结论 Tpackage能够实现典型控温包装的参数化建模，并有效评估控温包装的温度场分布。该研究可为控温包装优化设计提供参考，提高控温包装设计效率。

The work aims to develop a heat transfer simulation system for insulating packaging and effectively analyze the heat insulation effect of insulating packaging. With typical insulating packaging as the research object, a parametric modeling module of insulating packaging was designed based on OpenCASCADE, QT and VTK. The law of heat transfer inside and outside the packaging was analyzed, and the module of heat transfer solver for insulating package was developed. Two modules were integrated to realize the parametric modeling of insulating packaging and the numerical simulation of the heat transfer. Tpackage was used to conduct heat transfer simulation for two sets of insulating packaging (TC1 and TC2) at two ambient temperature of 30 ℃ and 40℃. Comsol was used for simulation under the same conditions. The maximum error of the time when the temperature measuring point reached 8 ℃ was as follows:7.04% (TC1-30 ℃), 9.87% (TC1-40 ℃), 8.82% (TC2-30 ℃), and 9.73% (TC2-40 ℃). The actual experiment was carried out at 30℃, and the comparison and verification under the same conditions by Tpackage showed that the maximum error of the time when the temperature measuring point of the product reached 8 ℃ was 9.47%. Therefore, Tpackage can realize the parametric modeling of typical insulating packaging and effectively evaluate the temperature field distribution in insulating packaging. The research can provide a reference for optimizing the design of insulating packaging and improving the design efficiency.