目的 综述无卤阻燃环氧树脂的最新研究进展，为开发高效阻燃封装材料提供研究思路和技术指导。方法 采用文献调研法介绍无卤阻燃环氧树脂的种类、阻燃机理，总结当前无卤阻燃环氧树脂在电子封装领域的应用现状和技术进展，并对其未来发展趋势进行展望。结果 与本征型无卤阻燃环氧树脂和反应型无卤阻燃环氧树脂相比，填充型无卤阻燃环氧树脂具有工艺简单、种类齐全、性能高效等优点，成为无卤阻燃环氧树脂中应用最广的种类。结论 无卤阻燃环氧树脂能够有效提升电子封装材料的火灾安全性，延长电子器件的使用寿命，促进5G电子器件的高速发展。

The work aims to review the latest research progress of halogen-free flame retardant epoxy and provide research ideas and technical guidance for the development of high efficient flame retardant packaging materials. The types and mechanism of halogen-free flame retardant epoxy were introduced by literature survey, the application status and technical progress of halogen-free flame retardant epoxy in electronic packaging were summarized, and the future development trend was prospected. Compared with the intrinsic and reactive halogen-free flame retardants, the filled halogen-free flame-retardant epoxy had the advantages of simple process, complete variety and high performance, it was the most widely used halogen-free flame retardant epoxy.Halogen-free flame epoxy could effectively enhance the fire safety of electronic packaging materials, extend the service life of electronic devices and promote the rapid development of 5G electronic devices.