HolyPan复合材料在中件空投系统中的应用研究

凡小平, 阳静, 刘进雷, 王光新, 王立鹏, 闻庆阳

包装工程(技术栏目) ›› 2023 ›› Issue (7) : 301-306.

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包装工程(技术栏目) ›› 2023 ›› Issue (7) : 301-306. DOI: 10.19554/j.cnki.1001-3563.2023.07.035

HolyPan复合材料在中件空投系统中的应用研究

  • 凡小平1, 阳静1, 刘进雷1, 王光新1, 王立鹏1, 闻庆阳2
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Application of HolyPan Composites in Medium-sized Airdrop System

  • FAN Xiao-ping1, YANG Jing1, LIU Jin-lei1, WANG Guang-xin1, WANG Li-peng1, WEN Qing-yang2
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摘要

目的 以HolyPan复合材料特性研究为基础,通过分析中件空投系统现存问题,研究HolyPan复合材料在中件空投系统中的应用。方法 首先,对HolyPan复合材料抗冲击、拉伸、悬挂强度等特性分别进行测试。其次,以HolyPan为主体材料,对现役中件空投系统进行改进设计。最后,对设计样品进行跌落缓冲试验,以验证HolyPan复合材料在中件空投系统应用中的合理性。结果 以HolyPan复合材料为主体设计的中件空投平台和中件空投集装箱,在缓冲性能等方面明显优于现役中件空投系统。结论 HolyPan复合材料在中件空投系统中的运用具有现实意义,可显著提高中件空投系统的安全性和可靠度。

Abstract

The work aims to study the application of HolyPan composites in medium-sized airdrop systems through analyzing the existing problems of medium-sized airdrop systems based on research of properties of HolyPan composites. Firstly, the impact resistance, tensile strength and suspension strength of HolyPan composites were tested respectively. Secondly, the HolyPan composites were applied as main body materials to carry out an improved design of medium-sized airdrop systems in service. Finally, a drop buffer test was conducted on the designed samples to verify the rationality of applying HolyPan composites in medium-sized airdrop systems. As a result, the medium-sized airdrop platforms and containers with main body of HolyPan composites were significantly superior to medium-sized airdrop systems in service in terms of buffer performance. In conclusion, the application of HolyPan composites in medium-sized airdrop systems has practical significance, which can significantly improve the safety and reliability of medium-sized airdrop systems.

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凡小平, 阳静, 刘进雷, 王光新, 王立鹏, 闻庆阳. HolyPan复合材料在中件空投系统中的应用研究[J]. 包装工程(技术栏目). 2023(7): 301-306 https://doi.org/10.19554/j.cnki.1001-3563.2023.07.035
FAN Xiao-ping, YANG Jing, LIU Jin-lei, WANG Guang-xin, WANG Li-peng, WEN Qing-yang. Application of HolyPan Composites in Medium-sized Airdrop System[J]. Packaging Engineering. 2023(7): 301-306 https://doi.org/10.19554/j.cnki.1001-3563.2023.07.035

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