异氰酸酯/脲醛树脂复合胶黏制备高强芦苇刨花板及性能研究

黄宇辉, 苏雨, 李锰, 唐运表, 覃掌吉, 卿彦, 李新功, 刘明

包装工程(技术栏目) ›› 2022 ›› Issue (23) : 63-70.

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包装工程(技术栏目) ›› 2022 ›› Issue (23) : 63-70. DOI: 10.19554/j.cnki.1001-3563.2022.23.008

异氰酸酯/脲醛树脂复合胶黏制备高强芦苇刨花板及性能研究

  • 黄宇辉1, 苏雨1, 李锰1, 卿彦1, 李新功1, 刘明1, 唐运表2, 覃掌吉2
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Preparation and Properties of High-strength Reed Particleboard with Isocyanate/Urea-formaldehyde Resin Composite Adhesive

  • HUANG Yu-hui1, SU Yu1, LI Meng1, QING Yan1, LI Xin-gong1, LIU Ming1, TANG Yun-biao2, QIN Zhang-ji2
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摘要

目的 为提升芦苇原料单元胶合性能、提高芦苇资源材料化利用率。方法 文中以异氰酸酯/脲醛树脂复合胶黏剂制备芦苇刨花板,并采用三因素三水平的正交试验,研究施胶量、热压时间和温度对板材静曲强度(MOR)、弹性模量(MOE)、内结合强度(IB)和吸水厚度膨胀率(TS)的影响。结果 研究发现,当异氰酸酯占复合胶黏剂质量的11.6%时,芦苇刨花板的较优热压温度、热压时间、施胶量分别为160 ℃、240 s、12%。以该复合胶黏剂制备的芦苇刨花板的MOR、MOE、IB、2 h TS和24 h TS分别为33.68 MPa、3 292 MPa、1.05 MPa、3.64%和9.45%,满足GB/T 4897—2015中在干燥状态下使用的重载型刨花板(6~13 mm)性能要求。结论 文中的研究拓宽了芦苇资源代替木材在包装材料领域的工业化利用。

Abstract

The work aims to improve the unit bonding performance of reed materials and the utilization of reed resources. Isocyanate/urea-formaldehyde resin composite adhesive was adopted to prepare reed particleboard. The orthogonal test with three factors and three levels was used to study the effect of adhesive consumption, hot pressing time and temperature on the static bending strength (MOR), internal bonding strength (IB) and thickness swelling (TS) of the board. When the isocyanate accounted for 11.6% of the composite adhesive, the optimum hot pressing temperature, hot pressing time and adhesive consumption of reed particleboard were 160 ℃, 240 s, and 12%. The MOR, MOE, IB, 2 h TS, and 24 h TS of the reed particleboard under these conditions were 33.68 MPa, 3292 MPa, 1.05 MPa, 3.64%, and 9.45%, meeting the requirements in GB/T 4897-2015 for heavy-duty particleboard (6-13 mm)in dry conditions. This study can broaden the industrial utilization of reed resources to replace wood in the field of packaging materials.

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黄宇辉, 苏雨, 李锰, 唐运表, 覃掌吉, 卿彦, 李新功, 刘明. 异氰酸酯/脲醛树脂复合胶黏制备高强芦苇刨花板及性能研究[J]. 包装工程(技术栏目). 2022(23): 63-70 https://doi.org/10.19554/j.cnki.1001-3563.2022.23.008
HUANG Yu-hui, SU Yu, LI Meng, TANG Yun-biao, QIN Zhang-ji, QING Yan, LI Xin-gong, LIU Ming. Preparation and Properties of High-strength Reed Particleboard with Isocyanate/Urea-formaldehyde Resin Composite Adhesive[J]. Packaging Engineering. 2022(23): 63-70 https://doi.org/10.19554/j.cnki.1001-3563.2022.23.008

基金

长沙科技项目(kq2004096);湖南省科技重大专项(2021NK1050)

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