目的 利用低温等离子体诱导铜络合物导电油墨实现在柔性基板上快速固化，制备出高导电柔性铜薄膜，并阐明油墨溶剂质量分数、预热处理时间、等离子体功率、处理时间等参数对铜膜固化结构与导电特性的影响规律。方法 通过调节油墨中的溶剂质量分数以改变油墨的铜含量及印刷铜薄膜的厚度;通过控制变量法优化低温固化工艺，并利用扫描电子显微镜、共聚焦显微镜、电阻率测量等手段表征柔性薄膜的物理特性;通过圆珠笔直写和卷对卷印刷方式测试所制备油墨与工艺在印刷柔性电子领域的适用性。结果 通过对油墨配方和等离子体处理工艺的协同优化，可以制备最薄为40 nm，最低电阻率为3.76 μΩ∙cm的柔性铜薄膜。结论 等离子体处理可以实现铜络合物油墨的低温快速固化制备高性能铜薄膜，在印刷柔性电子领域展现出了巨大的应用潜力。

The work aims to utilize low-temperature plasma to induce the rapid curing of copper complex inks, fabricate highly conductive copper films on flexible substrates, and illustrate the effects of solvent ratio, preheating treatment time, plasma power, and treatment time on the curing structure and conductivity of the copper film. The copper loading of the ink and the thickness of printed films were adjusted by changing the solvent ratio in the ink. The low-temperature curing process was optimized by controlling the variables. The physical characteristics of the obtained flexible films were characterized with scanning electron microscope, confocal microscope, and resistivity measurement. The applicability of the developed copper ink and the process in flexible electronics of printing was tested through ball-point pen direct writing and roll-to-roll printing. Flexible copper films with the thinnest thickness of 40 nm and the lowest resistivity of 3.76 μΩ∙cm could be fabricated by the synergistic optimization of the ink formula and plasma treatment. Plasma treatment can be utilized to realize the rapid curing of copper complex inks at a low temperature and fabricate high-performance copper films, which shows massive application potential in printed flexible electronics.