目的 分析柔性电子和柔性基底的发展现状、趋势和前景，为促进智能包装的进一步发展提供参考。方法 先从柔性基底材料入手，梳理常见基底材料性能;再综述柔性电子器件集成的研究现状及主要的集成技术，并讨论其在包装上的应用。结论 具有较好柔韧性和降解性的纸基可作为柔性电子集成的基底材料，结合柔性印刷电子技术和传统硅基电子技术的优势，将柔性电子器件通过蛇形互联结构集成并封装在柔性基底上，从而制备集成可拉伸的微系统，且随着新型印刷电子材料、印刷工艺、新技术和新设备的不断涌现，柔性电子器件集成于柔性基底上并应用于包装将成为一大研究热点。

The work aims to analyze the development status, trends and prospects of flexible electronics and flexible substrates to provide references for further development of smart packaging. Starting with flexible substrate materials, the properties of common substrate materials were sorted out; the research status and main integration technologies of flexible electronic device integration were summarized, and its application in packaging was discussed. Paper substrates with good flexibility and degradability can be used as a substrate material for flexible electronic integration. Combining the advantages of flexible printed electronic technology and traditional silicon-based electronic technology, flexible electronic devices are integrated and packaged on flexible substrates through a serpentine interconnection structure to prepare integrated stretchable micro-systems. With the continuous emergence of new printed electronic materials, printing processes, new technologies and new equipment, the integration of flexible electronic devices on flexible substrates and their application in packaging will become a major research hotspot.