目的 研究纳米银团簇的运动机理及连接料对团聚的影响。方法 以环氧树脂为导电银浆连接料，分别建立不同环氧树脂含量的纳米银团簇和环氧树脂模型，模拟不同环氧树脂含量下纳米银团簇的动力学平衡状况。结果 纳米银团簇在常温下极易发生团聚，加入环氧树脂后，系统能量虽然增大，但银团簇的运动活性明显降低；环氧树脂吸附于银团簇表面，阻止了银团簇间的团聚，银团簇的团聚倾向和银原子的运动活性随环氧树脂含量的升高逐渐降低；模拟结果显示，当环氧树脂质量分数增大至33%时，环氧树脂可起到防止银团簇团聚的效果。结论 在导电银浆中，纳米银团簇在常温下易团聚且受环氧树脂的影响较大。

The paper aims to study the effect of movement mechanism and linker of nano silver clusters on the ag-glomeration. In this paper, the nano silver clusters with different mass ratios were modeled with epoxy as the conductive silver paste connector to simulate the dynamic equilibrium of nano silver clusters with different mass ratios. The nano silver clusters were likely to agglomerate at room temperature. After adding epoxy, the energy of the system was increased, but the movement activity of the silver clusters was obviously decreased. The epoxy adsorbed on the surface of the silver clusters prevented the agglomerating tendency of the silver clusters to some extent. The agglomerating tendency of the silver clusters and the activity of the silver atoms were gradually decreased with the increase of the content of epoxy. The simulation results showed that when the mass fraction of epoxy increased to 33%, the epoxy could prevent the aggregation of silver clusters. In conductive silver paste, nano silver clusters tend to agglomerate at room temperature and are greatly influenced by epoxy.