目的 制备微胶囊红磷阻燃木塑复合材料，研究微胶囊红磷添加量对其力学性能、耐热性能和阻燃性能的影响，并扩大其应用范围。方法 以微胶囊红磷为阻燃剂，将其添加到低密度聚乙烯、线性低密度聚乙烯和木粉三元复合体系中，采用二次挤出造粒和注射成型法制备阻燃试样。研究材料的力学性能、耐热性能、应力破坏行为，确定材料的阻燃级别。结果 与未添加微胶囊红磷的木塑材料相比，当微胶囊红磷添加量（质量分数）达到10%时，材料的冲击强度由17.4 kJ/m2提高到19.0 kJ/m2，抗拉强度由19.53 MPa提高到21.7 MPa，断裂伸长率提高了58.7%，初始分解温度提高了73.17 ℃，阻燃达到V-0级，氧指数达到28.7%。结论 随着微胶囊红磷含量的增加，木塑复合材料的冲击强度、抗拉强度和断裂伸长率变大，初始分解温度提高，阻燃耐热性能变好；材料阻燃剂的添加量低，综合性能优良，在包装、建筑、家具等领域具有广泛应用前景。

The work aims to prepare microencapsulatedred phosphorus flame retardant wood-plastic composites and study the effects ofmicroencapsulatedred phosphorus content on mechanical properties, heat resistance and flame retardant properties of wood-plastic composites, and expand their range of application. Microencapsulated red phosphorus was used as flame retardant, and was added to the ternary system of low density polyethylene, linear low density polyethylene and wood powder. The flame retardant samples were prepared through secondary extrusion granulation and injection molding. The mechanical properties, heat resistance and stress failure behavior of the material were researched to determine the flame retardant level of materials. Compared with wood-plastic materials without microencapsulated red phosphorus, when the microencapsulated red phosphorus content (mass fraction) reached 10%, the impact strength of the materials increased from 17.4 kJ/m2 to 19.0 kJ/m2; the tensile strength increased from 19.53 MPa to 21.7 MPa; the elongation at break increased by 58.7%; the initial decomposition temperature increased by 73.17 ℃; the flame retardant reached V-0; and the oxygen index reached 28.7%.With the increase of microencapsulatedred phosphorus content, the impact strength, tensile strength and elongation at break of wood-plastic composites all increase; the initial decomposition temperature rises;and the flame retardant and heat resistance becomesbetter. The flame retardant of the material has low additive quantity and good comprehensive performance. It is widely used in packaging, construction, furniture and other fields.