目的 从氮化硼的表面改性、取向结构、形态含量以及杂化填料等4个方面介绍氮化硼填充导热复合材料的基础研究进展，为导热聚合物在电子封装领域的应用提供一定的研究思路。方法 通过对近年来国内外的相关文献进行分析和总结，归纳出微/纳氮化硼的产业化制备方法以及产品性能，并介绍微/纳氮化硼填料对聚合物基复合材料导热性能影响的研究情况。结论 氮化硼各方面均具有优异的性能，可用于制备填充型高导热复合材料。

This paper introduced the basic research progress of boron nitride (BN) filled thermal conductive composites from four aspects: surface modification, orientation structure, morphology and content of BN filler as well as hybrid fillers, which provided some research ideas for application of thermal conductive polymers in the field of electronic packaging. Based on analysis and summary of the related literatures at home and abroad in recent years, the industrial preparation methods and product properties of micro/nano BN were summarized. Then, the research progress of micro/nano-BN fillers on the thermal conductivity of polymer matrix composites was introduced. Then the thermal conducting mechanism of the composites was discussed. The excellent properties of BN make it possible to prepare filled high thermal conductive composites.